贴片3D检测技术的应用研究  

Applied Research on 3D Detection T echnology on Paster

作　　者：焦伟 

机构地区：[1]珠海格力电器股份有限公司,珠海519070

出　　处：《日用电器》2017年第5期39-42,55,共5页ELECTRICAL APPLIANCES

摘　　要：本文主要对贴片机3D检测技术的应用进行研究,从贴片3D检测的原理进行分析,引出3D检测的影响因素,分析引脚起翘的高度关系,通过DOE实验过程,得到贴片3D的最佳检测参数,以及最佳的引脚起翘公差,将芯片引脚变形严重的芯片拦截在贴装前,从而保证贴片的质量,避免返修对产品可靠性带来的影响。This paper mainly researches the application of 3D detection technology on paster. From the perspec- tive of its principle, this paper introduces the influence factors of 3D detection, and analyzes the close relationship with pin crimp. Through DOE experiment, the optimal detecting parameter of 3D paster and pin crimp tolerance are obtained, in order to intercept the chips with serious pin deformation before pasting, so as to guarantee the quality of paster, and to avoid the bad effect of repairing on the reliability of products.

关 键 词：自动贴片机 3D检测 DOE 

分 类 号：TN405[电子电信—微电子学与固体电子学]