制备温度对聚酰亚胺薄膜真空摩擦学性能的影响  

Influence of preparation temperature on the vacuum tribological property of polyimide film

作　　者：史晓辉[1] 尹建军[1] 刘百幸[2] 梁军[2] 彭振军[2] 

机构地区：[1]兰州理工大学石油化工学院,兰州730050 [2]中国科学院兰州化学物理研究所固体润滑国家重点实验室,兰州730000

出　　处：《化工新型材料》2017年第5期103-105,共3页New Chemical Materials

基　　金：国家自然科学基金青年基金项目(51405472)

摘　　要：采用溶解的聚酰亚胺(PI)模塑粉在2024铝合金基底上制备PI薄膜,考察了不同制备温度对PI薄膜的力学性能和结合力,以及在真空环境下的摩擦磨损性能的影响。结果表明,随着制备温度的升高,PI薄膜的力学性能明显提高,其与基底的结合力逐渐增强,摩擦系数与磨损率逐渐增大。在300℃条件下制备的PI薄膜具有最佳的综合性能。The polyimide films were prepared on 2024 aluminum alloy substrate by dissolution of polyimide （PI） moulding powder. The effects of preparation temperature on the mechanical properties and adhesion of PI films were investigated. The friction and wear properties of PI films in vacuum environment were evaluated. The results showed that the mechanical properties and adhesion of PI films improved obviously with the increase of preparation temperature. However, the friction coefficient and wear rate of PI films increased gradually with increasing the preparation temperature. The PI films prepared at 300℃ exhibited the best comprehensive performance.

关 键 词：聚酰亚胺 真空环境 制备温度 摩擦磨损性能 

分 类 号：TB383.2[一般工业技术—材料科学与工程] TQ323.7[化学工程—合成树脂塑料工业]