基于介质阻挡放电实现高分子薄膜与金属层间有机黏合实验方法  

An Experimental Method Study of Organic Adhesive between Cu and Polyethylene Films Based on Dielectric Barrier Discharge

作　　者：钱沐杨[1] 杨小松[1] 陈辉[1] 刘三秋[1] 任春生[2] 

机构地区：[1]南昌大学物理系,南昌330031 [2]大连理工大学物理与光电工程学院,辽宁大连116024

出　　处：《实验室研究与探索》2017年第4期8-10,15,共4页Research and Exploration In Laboratory

基　　金：国家自然科学基金项目(11465013);江西省科技厅自然科学基金项目(20151BAB212012;20161BAB201013)

摘　　要：提出一种新型的金属与聚乙烯薄膜层间有机黏合方法,能够实现薄膜层之间的有机黏合。该方法基于大气压Ar/O2介质阻挡放电对聚乙烯薄膜表面改性预处理,利用射频电感耦合等离子体增强非平衡磁控溅射系统在预处理的聚乙烯薄膜表面镀铜膜。研究结果表明,介质阻挡放电处理聚乙烯薄膜表面,引入了氧原子功能团(C—O,C=O,O—C=O等),导致薄膜表面自由能的增加。此外,这种方法得到的薄膜层之间黏着强度为1.5 MPa;而铜膜与未进行等离子体预处理聚乙烯之间的黏着强度仅为0.8 MPa。此外,SEM照片也显示,经过等离子体预处理后聚乙烯表面的电镀铜膜晶粒较小且分布更均匀。For a long time, it was found that organic adhesive between Cu and polyethylene （PE） films has enormously potential and possible applications, such as electronic semiconductor, machinery manufacturing, and construction industry. Peel adhesive strength between metal and polymer film layer was insufficient by using traditional hot melt adhesive method. In this paper, a novel method based on atmospheric pressure DBD was proposed to achieve organic adhesive between Cu and PE layers. First, the surface modification of PE film was completed by using atmospheric pressure Ar/O2 DBD. Then, Cu film was deposited with an unbalanced magnetron sputtering system which was enhanced by radio frequency inductively coupled plasma. Experimental results showed that some atomic oxygen functional groups （C-O, C = O, O-C = O, etc. ） were introduced onto PE surface by the DBD plasma treatment, which led to an increase in surface free energy. The peel adhesive strength between Cu and treated PE films was 1.5 MPa, while this value was only 0.8 MPa by the traditional method. SEM pictures also demonstrated that Cu film deposited on the plasma treated PE surface was much smooth and crystal grain was smaller.

关 键 词：大气压介质阻挡放电 金属与高分子聚合物黏合 极性基团 黏着强度 

分 类 号：O461.1[理学—电子物理学]