IC铜合金引线框架生产污染状况分析与治理措施  

The Pollution Situation Analysis and Pollution Control Measures of the IC Copper Alloy Lead Frame Production

作　　者：于照阳[1] 马国[1] 马普利 史云杰[1] 

机构地区：[1]西北矿冶研究院,甘肃白银730900

出　　处：《甘肃冶金》2017年第3期101-105,111,共6页Gansu Metallurgy

摘　　要：IC引线框架用铜带是集成电路的重要基础材料。通过蚀刻法生产引线框架的生产工艺流程及原理入手,分析工艺污染物产生环节、污染物特征以及排放方式等,针对性的提出相应的治理措施,为今后同类型的建设项目提供借鉴。IC lead frame with copper belt is an important basis material for integrated circuit.This paper started from analyzing the production process and principle of the etching method to produce lead frame, then analyzed the generating links, characteristics and emissions patterns of pollutants At last, it put forward the corresponding measures to control pollution, simultaneously, this paper will provide reference for the same type construction projects for the future.

关 键 词：蚀刻法 选择性电镀 铜带 一步净化器 吸收塔 洗涤塔 

分 类 号：X78[环境科学与工程—环境工程]