PCB信号传输导体高密度化要求和发展——PCB制造技术发展趋势和特点(2)  

PCB manufacturing technology trends and characteristics——High density requirements and development of PCB signal transmission conductors(2)

作　　者：林金堵 

出　　处：《印制电路信息》2017年第6期5-18,共14页Printed Circuit Information

摘　　要：文章评论了PCB中信号传输高频化的要求和发展。信号高频化给PCB带来主要课题有:趋肤效应,要求导体表面精细/光滑化;减少电磁干扰等的信号失真课题;低介电常数和介电损耗材料。因此,高频化PCB必须选择低εr和Df材料、优化高频化设计、注重精细化制造控制和管理等才能达到目标!This paper reviews the requirements and development of high frequency signal transmission in PCB. The high frequency of the signal of the PCB brings about the main topic： the skin effect, requirement of the conductor surface fine/smooth; reduction of electromagnetic interference and other signal distortion problems; low dielectric constant and dielectric loss material. Therefore, the high frequency of PCB must be： select low Dk and Df materials, ontimize the design of high frequency and manufacturing control and management.

关 键 词：信号传输高频化 趋肤效应 电磁干扰 特性阻抗 

分 类 号：TN41[电子电信—微电子学与固体电子学]