化学镀镍镀钯浸金表面处理常见品质缺陷及解决方案  

The common quality defects of ENEPIG and solutions

作　　者：贾莉萍[1] 陈苑明[1] 王守绪[1] 

机构地区：[1]电子科技大学电子薄膜与集成器件国家重点实验室,四川成都610054

出　　处：《印制电路信息》2017年第6期19-24,共6页Printed Circuit Information

基　　金：广东省省级科技计划项目(项目编号2015B010127012)的资助

摘　　要：在各种表面处理技术中,化学镀镍镀钯浸金(ENEPIG)因具有良好的综合性能,被认为是PCB最理想的表面处理技术,但在实际工艺中容易出现漏镀,渗镀,金面异色,金面腐蚀等品质缺陷问题,影响产品可靠性。文章介绍了镍钯金表面处理技术中常出现的几种品质缺陷,并通过对其进行原因分析。In all kinds of surface treatment technology, electroless nickel electroless palladium immersion gold （ENEPIG） becomes a suitable surface finish for IC packages and fine PCB. ENEPIG is considered to be the most ideal surface finish technology, a series of quality defects have arisen in the ENEPIG technological process, including miss plating, over plating, discoloration on Au layer and so on, which affect the reliability of the products. This article introduces several common defects of quality in the ENEPIG technological process. Furthermore, by analyzing the reason, the corresponding solutions are put forward to improve the reliability of products.

关 键 词：表面处理 化学镀镍镀钯浸金 可靠性 品质缺陷 解决方案 

分 类 号：TN41[电子电信—微电子学与固体电子学]