梁式封装二极管的微组装技术  

Microcircuit Packaging Technology For Beam Encapsulation Diode

作　　者：李伟[1] 吕翼[1] 陶毅[1] 杨桃均[1] 张静雯[1] 王岚[1] 

机构地区：[1]中国电子科技集团公司第二十六研究所,重庆400060

出　　处：《压电与声光》2017年第3期448-451,共4页Piezoelectrics & Acoustooptics

摘　　要：该文介绍了梁式封装二极管(BED)的微组装技术(MPT)的现状及其问题,重点对超声热压倒装焊与粘胶互联进行了实验与仿真,分析了不同电极与基板镀层等因素对装配方案的影响,并通过受力实验进行验证。提出了有效规范的装配方案和可靠、易行的工程结论,解决了梁式封装二极管装配方案混乱,批量一致性差,调试难度大,成本高等问题。The current status and problems of the microcircui t packaging technology （MPT） for beam encapsula-tion diode （BED） are introduced in this paper. The experiment and simulation on the ultrasonic hot embossing flip chip （FC） and the viscose interconnection are carried out, the influences of different electrodes and the substrate coating on the assembly scheme are analyzed and validated through the stress experiment. The effective norm assem-bly scheme and reliable and feasible engineering specification conclusion are put forward. The problems of chaotic beam diode assembly scheme, poor batch consistency, difficult debugging and high cost have been solved.

关 键 词：梁式封装二极管(BED) 微组装技术(MPT) 超声热压倒装焊 粘胶互联 HFSS 电极 基板镀层 

分 类 号：TN311[电子电信—物理电子学]