一种化学还原镀金液复合配位剂的研究  

Compound Coordination Agent of Electroless Gold Plating

作　　者：肖忠良[1] 卢意鹏 刘姣[1] 曾鹏[1] 周朝花[1] 吴蓉[1] 吴道新[1] 曹忠[1] 

机构地区：[1]长沙理工大学化学与生物工程学院,长沙410114

出　　处：《表面技术》2017年第6期263-269,共7页Surface Technology

基　　金：国家自然科学基金(31527803;21501015;21545010);湖南省战略性新兴产业科技攻关与重大成果转化项目(2015GK1046)~~

摘　　要：目的研究由乙二胺四乙酸二钠(EDTA-2Na)、乙二胺四亚甲基膦钠(EDTMPS)和柠檬酸三铵(C_6H_5O_7(NH_4)_3)组成的复合配位剂,在不同浓度及pH下,对金沉积速率、镀金液稳定性、金镀层结构及性能的影响。方法用化学镀的方法在树脂基体上先预镀覆Cu-Ni-Pd金属层,然后制备金镀层。采用正交实验法,研究复合配位剂浓度及pH对金层沉积速率、镀金液稳定性、结合力、光亮度的影响。借助扫描电镜及能谱,分析不同优化组合镀液配方制备的镀层形貌及成分。结果以镀金沉积速率为评价指标时的最优组合为A_2C_3D_3B_2,以镀液稳定性为评价指标时的最优组合为A_2C_2B_3D_2,以镀层结合力为评价指标时的最优组合为A_2D_2B_2C_2,以镀层光亮度为评价指标时的最优组合为A_3C_1D_2B_2。将4个单一评价指标的最优组合重复实验,实验结果表明,当EDTA-2Na为15 g/L、EDTMPS为3 g/L、C_6H_5O_7(NH_4)_3为30 g/L、pH为6.0时,镀液稳定性最高,可达6 MTO;镀层沉积速率最快,可达0.0066μm/min;镀层结合力可达5级,光亮度可达1级。结论采用EDTA-2Na、EDTMPS和C_6H_5O_7(NH_4)_3组成的复合配位剂,在适当的pH下能够提高镀层沉积速度及镀液稳定性,改善镀层表面形貌。The work aims to study effects of the compound coordination agent consisting of Disodium Ethylenediamine Te- traacetate （EDTA-2Na）, Sodium Ethylenediamine Tetramethylene Phosphonic （EDTMPS） and Ammonium Citrate （C6HsO7（NH4）3） on deposition rate, stability of plating solution as well as structure and properties of gold plating provided with different concentration and pH. The Cu-Ni-Pd metal layer was pre-plated on resin substrate by electroless plating, and then the gold plating was prepared. The effects of concentration and pH of compound coordination agent on deposition rate of gold plat- ing, stability of plating solution, adhesion and brightness were studied by performing orthogonal experiment. Morphology and composition of the plating prepared in different optimized groups of plating solution formula were analyzed with scanning elec- tron microscopy （SEM） and energy dispersive spectroscopy （EDS）. The optimum combination was A2C3D3B2 when gold depo-sition rate was taken as evaluation index, A2C2B3D2 when the stability of plating solution was taken as the evaluation index, A2D2B2C2 when the binding force was taken as the evaluation index, A3C1D2B2 when the adhesion was taken as the evaluation index. The optimum combination of four single evaluation indices was repeated. Provided with 15 g/L of EDTA-2Na, 30 g/L of C6HsO7（NH4）3 and pH of 6.0, the plating deposition rate was the fastest, stability of the plating solution was the highest, up to 6 MTO, adhesion up to level 5, brightness up to level 1. The compound coordination agent consisting of EDTA-2Na, EDTMPS and C6HsOv（NH4）3 in appropriate pH can improve the depositing speed and stability of plating solution, and thereby improve morphology of the plating.

关 键 词：化学还原镀金 复合配位剂 沉积速率 稳定性 结合力 光亮度 

分 类 号：TQ153.1[化学工程—电化学工业]