全彩LED显示屏COB封装模组  

COB Package Module with Full Color LED Display

作　　者：蒋富裕 王娟 区燕杰 吴懿平[3] 

机构地区：[1]广东天圣高科股份有限公司,广东中山528412 [2]广东华南半导体光电研究院,广东江门529000 [3]华中科技大学材料科学与工程学院,湖北武汉430074

出　　处：《电子工艺技术》2017年第3期125-127,134,共4页Electronics Process Technology

基　　金：广东省产学研计划基金项目(项目编号:2013B090600031)

摘　　要：提出了一种点间距为2 mm的全彩LED显示屏COB封装模组的封装工艺方法。COB封装技术的应用,简化了当前表面贴装LED显示屏制造工艺,提高了LED显示屏的像素密度,增强了LED显示屏可靠性,为当前小间距高清高分辨率LED显示屏的封装制造提供了一个可供选择的技术方案。A COB package of LED display module is presented. The COB display module has a pixel pitch of 2 mm and full color luminescence. Compared with the commonly used surface mount LED display module, COB display module manufacturing process has been greatly simplified. Moreover, the COB display module improves the pixel density of the LED display, and enhances the reliability of the LED display screen. This COB display module is expected to become an alternative technical solution for high resolution, small pitch LED display module.

关 键 词：COB显示模组 LED显示屏 小间距 高清显示 

分 类 号：TN605[电子电信—电路与系统]