C_(PK)在生瓷片打孔工艺中的应用  

Application of C_(PK) to Punching Process of Green Ceramic

作　　者：吕琴红[1] 董永谦[1] 王增琴[1] 高峰[1] 李兴[1] 

机构地区：[1]中国电子科技集团公司第二研究所,山西太原030024

出　　处：《电子工艺技术》2017年第3期171-173,共3页Electronics Process Technology

摘　　要：C_(PK)是现代企业用于表示工艺过程能力的指标,可反映工艺过程合格率的高低。充分利用C_(PK)的特点,将C_(PK)应用于生瓷片打孔工艺中,可有效提高生瓷片打孔机的良品率。实验结果证明,基于C_(PK)的通孔检测可客观评价工艺水平,提高产品良品率,降低生产成本,促进打孔机质量改进。CPK represents process capability index in modern enterprise, can reflect the process level of acceptability. Take full advantage of the characteristics of CPK, and is applied to punching process of green ceramics, improve the yield of punching equipment for green ceramics. The result of Experiments showed that the through-hole inspection based on CPK can objectively evaluate the level of process, increase the percentage of good products, reduce the cost of production, and promote the improvement of the quality of the punching machine.

关 键 词：过程能力指数 生瓷片 打孔 通孔检测 

分 类 号：TN605[电子电信—电路与系统]