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作 者:周蕾[1] 史庆南[2] 蔡晓兰[1] 王军丽[3]
机构地区:[1]昆明理工大学冶金与能源工程学院,云南昆明650093 [2]昆明理工大学材料科学与工程学院,云南昆明650093 [3]昆明理工大学分析测试中心,云南昆明650093
出 处:《材料热处理学报》2017年第6期25-30,共6页Transactions of Materials and Heat Treatment
基 金:国家自然科学基金(51064016);云南省重大项目(2014FC001);云南省高校金属粉体制备与设备开发科技创新团队支持计划资助(14051693)
摘 要:采用背散射电子衍射(EBSD和透射电镜(TEM)研究了纯铜大变形异步累积叠轧与再结晶过程中的低重合位置点阵(ΣCSL)晶界演化过程。研究表明:纯铜在600℃长时间均匀化退火时,形成大量较长的平直共格Σ3晶界,并作为大角度晶界阻碍晶粒的异常长大;在随后的大变形异步累积叠轧中,随着晶粒转动,形变组织的形成,低ΣCSL晶界的逐渐减少;再结晶退火中形成大量超细孪晶,同时形成大量Σ3特殊晶界,并与高ΣCSL晶界反应,形成大量低ΣCSL晶界,Σ1小角度晶界迅速增多,阻断一般大角度晶界网络,表明Σ3晶界的反应是大变形+退火纯铜晶界特征分布(GBCD)的优化机制。The evolution of low -∑ CSL boundaries of ultra-fine twin copper in the process of asymmetrical accumulative rolling bonding (AARB) and recrystallization was studied by means of electron back-scattering diffraction (EBSD) technique and transmission electron microscopy ( TEM ). The results show that a large number of coherent ∑3 boundaries are obtained during homogenizing annealing at 600 ℃ for a long time, which it as large angle twin boundaries can put off the anomaly grain growth. In the subsequent lager strain deformation AARB, the fraction of low - ∑ CSL boundaries gradually decreases due to the grain rotation and the formation of deformation structure. During recrystallization annealing, a large number of ultra-fined twins are obtained, and the fraction of ∑3 and ∑9 boundaries increases. The reaction of ∑3 boundaries with high - ECSL boundaries produces a large number of low - ∑CSL boundaries. The fast growing of ∑1 low-angle boundaries can block the net of high-angle boundaries. The interaction of ∑3 boundaries are the mechanism of grain boundary characteristics distribution(GBCD) optimization of the copper prepared by severe deformation and annealing.
关 键 词:铜 异步累积叠轧 再结晶 重合位置点阵 晶界特征分布
分 类 号:TG146.1[一般工业技术—材料科学与工程]
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