高功率双包层掺铥光纤放大器温度分布特性（英文）  

Thermal distribution characteristic of high-power laser double-cladding Thulium-doped fiber amplifier

作　　者：张海伟[1,2] 盛泉[1,2] 史伟[1,2] 白晓磊[1,2] 付士杰[1,2] 姚建铨[1,2] 

机构地区：[1]天津大学精密仪器与光电子工程学院,天津300072 [2]天津大学光电信息技术教育部重点实验室,天津300072

出　　处：《红外与激光工程》2017年第6期193-200,共8页Infrared and Laser Engineering

基　　金：国家高技术研究发展计划(2014AA041901);国家自然科学基金(61335013,61275102);天津市科技支撑重点项目(2015ZDJS02001);山东自主创新与成果转化项目(2014ZZCX04212)

摘　　要：通过对普适于不同内包层边界条件下的热传导方程进行推导和求解,得到了不同内包层形状的双包层增益光纤所对应的掺铥光纤放大器的三维热分布。计算结果表明,双包层光纤不同内包层形状可导致纤芯处的温度差高达107 K。同时,信号光与泵浦光功率的比值决定了温度最高点和熔接点的距离,在泵浦光功率为100 W、信号光功率为10 mW的情况下,两者之间的距离可达30 cm。通过分析不同内包层形状的双包层光纤的径向与轴向的热分布情况发现,相较于其他内包层形状的双包层光纤,偏芯型双包层掺铥光纤因其具有较低的最高温度、较高的泵浦效率和高斯型横截面热分布而较适用于掺铥光纤放大器。The three-dimension thermal distributions in double-cladding high-power Thulium-doped fiber amplifier （TDFA） with different inner-cladding shapes were achieved by solving the analytical thermal conductive equation with different inner-cladding boundary conditions. It indicates that the temperature difference induced by the overlap factor of double-cladding fibers （DCFs） with different inner-cladding shapes can be up to 107 K in the core. Moreover, the distance between the splice point and the position with maximum temperature relies on the ratio of the seed power to pump power and it can be 30 cm when pumped with 100 W and seeded with 10 mW. By analyzing the transverse and longitudinal thermal distribution, it is demonstrated that the offset DCF may be a better choice for TDFA due to its lower maximum temperature, high pump efficiency and Gaussian thermal distribution on the cross-section.

关 键 词：掺铥光纤放大器 热效应 双包层光纤 解析模型 

分 类 号：TN248[电子电信—物理电子学]