热载荷下金属间化合物厚度对焊点可靠性的影响  

Effect of intermetallic compound thickness on solder joint reliability under thermal cycling loading

作　　者：宋昱含 杨雪霞[1] 崔小朝[1] 

机构地区：[1]太原科技大学应用科学学院,山西太原030024

出　　处：《电子元件与材料》2017年第7期85-88,92,共5页Electronic Components And Materials

基　　金：国家自然科学基金项目资助(No.5157040251;No.11602157);山西省青年科技研究项目资助(No.2015021017);山西省高等学校科技创新项目资助(No.2015167);太原科技大学博士启动项目资助(No.20132015)

摘　　要：研究了在热循环载荷条件下,不同厚度的金属间化合物IMC(Intermetallic Compound)层对焊点可靠性的影响。采用Anand本构模型描述无铅焊点在热载荷条件下的粘塑性力学行为,运用有限元模拟电子封装器件在热载荷循环下的应力应变的变化规律,确定关键焊点的位置,得到关键焊点的关键点的应力、应变与时间关系的曲线,分析IMC层厚度与寿命关系曲线,并确定其函数关系。研究表明:在热载荷条件下IMC层厚度越大,其焊点的可靠性越低,寿命越短。在IMC层厚度为8.5μm时,IMC厚度对焊点寿命的影响率出现明显的变化,影响率由–32.8突然增加到–404,当IMC厚度为14.5μm时,焊点的寿命值出现了跳跃。Under thermal cycling load conditions, the effect of intermetallic compound（IMC） layers with different thicknesses on the reliability of solder joints was studied. The viscoplastic mechanic behavior of lead-free solder joints with the thermal loading condition was described by using Anand constitutive model. Finite element method was used to simulate the stress-strain variation rule for electronic package devices under thermal cycling condition and to identify the location of key solder joints, and the stress-strain-time curve for the key solder joints was obtained. Then the function relationship between IMC layer thickness and solder joint lifetime was found out by analyzing the relationship curve between IMC layer thickness and solder joint lifetime. The results show that under the thermal loading condition, the thicker the IMC layer is, the less reliability and lifetime of the solder joint. When the thickness of IMC layer reaches 8.5 μm, the influence rate of IMC layer thickness on solder joint lifetime appears obvious change. The influence rate increases abruptly from –32.8 to –404. When the thickness of IMC layer reaches 14.5 μm, the lifetime data of the solder joint appears to jump.

关 键 词：金属间化合物 等效塑性应变 IMC厚度 热循环载荷 有限元 可靠性 

分 类 号：O34[理学—固体力学]