基于片式固体钽电容器标准变更的质量风险管理  

Quality risk management based on standard alteration of chip solid tantalum capacitor

作　　者：支越[1,2] 梁永红[2] 王之哲 

机构地区：[1]江苏大学管理学院,江苏镇江212013 [2]工业和信息化部电子第五研究所,广东广州510610

出　　处：《电子元件与材料》2017年第7期89-92,共4页Electronic Components And Materials

摘　　要：片式固体钽电容器新版国军标GJB2283A—2014《片式固体电解质钽固定电容器通用规范》相对于GJB2283—1995《有可靠性指标的片式固体电解质钽电容器总规范》,在增加宇航级质量等级(T级)及其相关要求的同时,还给出修改再流焊条件和浪涌电流条件的试验方法及要求,这对片式固体钽电容器研制过程的质量风险管理提出了新的要求与挑战。通过分析片式固体钽电容器标准变更的重点项目,研究制定质量风险检查表,为研制单位的质量风险管理提供指导和借鉴。Compared with GJB2283-1995 General Specification for Chip Solid Electrolyte Tantalum Capacitors with Reliability Parameters, the test method and requirement under reflow welding and surge current conditions, and the assessment requirement of aerospace chip solid tantalum capacitors were added in the new standard GJB2283A-2014 General Specification for Chip Solid Electrolyte Fixed Tantalum Capacitors, which brought new requirement and challenge for quality risk management of chip solid tantalum capacitor manufacturing. A quality risk checklist was proposed by analyzing the key items of standard alteration of chip solid tantalum capacitor, which was instructive for the quality risk management of enterprises.

关 键 词：片式固体钽电容器 标准变更 质量风险管理 风险检查表 通用规范 宇航 

分 类 号：TM934.21[电气工程—电力电子与电力传动]