抄造工艺对PCB用对位芳纶纸性能的影响  

Research on papermaking performance of para-aramid for PCB

作　　者：杨勇[1,2] 王芳[1,2] 唐爱民[3] 

机构地区：[1]中国石化仪征化纤有限责任公司,江苏仪征211900 [2]江苏省高性能纤维重点实验室,江苏仪征211900 [3]华南理工大学制浆造纸工程国家重点实验室,广东广州510640

出　　处：《合成技术及应用》2017年第2期31-34,共4页Synthetic Technology & Application

摘　　要：探讨了对位芳纶浆粕用量、浆粕的内在性能及增强剂含量对芳纶纸性能的影响。研究结果表明,印刷电路板(PCB)用对位芳纶原纸的抗张指数和撕裂指数与对位芳纶浆粕用量、浆粕的内在性能及增强剂用量有着密切的关联。; The influences on the strength properties of para - aramid paper were investigated, such as the proportion of para - aramid pulp, performance of para - aramid pulp, and reinforcing agent dosage. The results showed that dosage of para - aramid pulp, pulp performance and reinforcing agent dosage were the important factors for the tensile index and tear index of para - aramid base paper.

关 键 词：芳纶浆粕 抗张指数 撕裂指数 芳纶原纸 短切纤维 增强剂 

分 类 号：TS714[轻工技术与工程—制浆造纸工程]