直流电解沉积纳米孪晶铜的微观结构与硬度研究  

Study on Microstructure and Hardness of Direct-current Electrodeposited Nanotwinned Cu

作　　者：温淑敏[1] 王博林[1] 赵春旺[1,2] 王细军 侯清玉[1] 

机构地区：[1]内蒙古工业大学理学院,内蒙古呼和浩特010051 [2]上海海事大学文理学院,上海201306 [3]乌兰察布广播电视台,内蒙古集宁012000

出　　处：《热加工工艺》2017年第12期107-109,共3页Hot Working Technology

基　　金：国家自然科学基金项目(11272142;51261017;61366008;11562106);内蒙古工业大学校重点项目(ZD201220)

摘　　要：采用直流电解沉积技术在不同电流密度下制备了纳米孪晶铜。讨论了电流密度对纳米孪晶铜沉积速率、微观组织和硬度的影响。结果表明:电流密度的升高使沉积速率增大,但是过高的电流密度反而使沉积速率急剧下降。电流密度大于70mA/cm^2时,纳米孪晶铜的硬度有减少的趋势。Nanotwinned Cu was successfully prepared by direct-current electrodeposition under different current densities. The effects of current density on the deposition rate, microstructure and hardness ofnanotwinned Cu were discussed. The results show that the increase of current density could make an increase in electro-deposition rate, but the electro-deposition rate may generate a sharp decline under too high current density. The hardness of nanotwinned Cu has a tread of decrease when the current density is higher than 70 mA/cm2.

关 键 词：直流电解沉积 纳米孪晶 铜 硬度 

分 类 号：TG146.11[一般工业技术—材料科学与工程]