粘接结构的空气耦合超声导波检测仿真信号研究  

Simulation Received Signal in Bonded-Joint Inspection using Air-coupled Guided Waves

作　　者：江洋[1] 罗林[1] 王泽勇[1] 

机构地区：[1]西南交通大学物理科学与技术学院,四川成都610031

出　　处：《通信技术》2017年第6期1188-1192,共5页Communications Technology

摘　　要：利用仿真软件模拟了频率为500 kHz的空气耦合超声探头对长度为200 mm、厚度为2.1 mm的双层铝粘接板的导波检测过程,其中粘接剂厚度为0.1 mm。通过理论计算和仿真模型,找到该条件下的最佳导波检测模式,并在仿真模型中模拟检测带有缺陷长为20 mm的粘接结合处,将带有缺陷的粘接结合处信号与完整的粘接结合处信号作对比分析。结果表明,信号中幅值及相位的改变证明了缺陷的存在,同时也证明了空气耦合超声技术在粘接结合处进行导波检测的可行性。Simulation model is established in COMSOL, which describes the aluminum-bonded joint inspected by air-coupled ultrasonic probe, and the aluminum-bonded joint is 200 mm in length, 2.1 mm in thickness, and 0.1 mm in adhesive thickness. Theoretical calculation and simulation analysis indicate the best inspecting mode in this situation. After the inspection that disbond joint in the model and based on the comparison of the imperfect signal and the sample signal, the existence of defect proved by the difference of phase and amplitude, and this also verifies the feasibility of the bonded-joint inspection using air-coupled ultrasonic guided waves.

关 键 词：空气耦合超声 粘接结构 导波 有限元仿真 

分 类 号：TP391.9[自动化与计算机技术—计算机应用技术]