多层板图形的涨缩预放探讨  

Discuss on the shrinkage-stretch pre-release in multilayer PCBs

作　　者：黄干宏 黄李海 HUANG Gan-hong HUANG Li-hai

机构地区：[1]博敏电子股份有限公司,广东梅州514000

出　　处：《印制电路信息》2017年第7期13-18,共6页Printed Circuit Information

摘　　要：多层板制造流程长工序多,易出现不同程度的涨缩变化。通过对曝光底片涨缩进行跟进分析及对板材在不同工序生产后的涨缩变化,从而找出涨缩变化的规律性及变化值。In multilayer board manufacturing process, there are many machining process. In order to ensure the product expansion can meet the needs of customers, it discusses the method through the exposure film expansion analysis and follow up on the plate in different production processes after these changes. The purpose is to identify the changes and regularity of these changes in value.

关 键 词：印制电路板 涨缩 底片 预放 

分 类 号：TN41[电子电信—微电子学与固体电子学]