温度对振动载荷下互连微焊点寿命的影响  

Effect of temperature on the life of solder interconnects subjected to vibration loading

作　　者：张洪武[1] 刘洋[1] 王健[1] 孙凤莲[1] 周真[2] 

机构地区：[1]哈尔滨理工大学材料科学与工程学院,哈尔滨150040 [2]哈尔滨理工大学测控技术与通讯工程学院,哈尔滨150040

出　　处：《焊接学报》2017年第6期83-86,共4页Transactions of The China Welding Institution

基　　金：国家自然科学基金资助项目(51174069)

摘　　要：设计了温度-定频振动两场耦合可靠性试验,应用两参数weibull统计分析和物理失效分析方法,分析了温度(25,100℃)对振动载荷下微焊点寿命的影响.结果表明,温度由25℃升高到100℃,振动载荷下的微焊点寿命显著提高,U1位置处焊点寿命提高了106%,U2位置处焊点寿命提高了180%;失效模式统计分析表明,随着温度的升高,焊点由界面裂纹(裂纹产生在界面处的金属间化合物与铜焊盘之间)转变为体钎料裂纹(裂纹产生在体钎料处),失效机制由脆性断裂转变为韧性断裂,失效机制的转变与焊点寿命密切相关.The test which combined temperature and vibration was designed. The methods of two-parameter weibull distribution and failure analysis were applied. The effect of temperature( 25 ℃ and 100 ℃) on solder interconnects subjected to vibration loading was studied. Results indicate that the temperature increase improves solder interconnects life. The solder joints at 25 ℃ and 100 ℃ always exhibit three fracture modes,interfacial crack between IMC( Intermetallic Compound)/Cu pad,crack through the bulk solder and mixed crack( both interfacial crack and crack through the bulk solder). However,the main failure mode at two temperatures is obviously different. Results indicate that the main failure mode at 25 ℃ is the crack between IMC and copper pad,while the main failure mode at 100 ℃ is the crack through the bulk solder. The failure mechanism is transformed from brittle fracture to ductile fracture with temperature rise from 25 to 100 ℃.

关 键 词：寿命 温度-振动耦合 失效模式 失效机制 

分 类 号：TG405[金属学及工艺—焊接]