低压湿热环境TPM刀片式板卡插箱的热设计与分析  

Thermal Design and Analysis of a Blade Type Card Plug Box in Low Pressure and Damp Heat Environment

作　　者：彭伟[1] 崔珍珍[1] 谢标[1] 卢德辉[1] 

机构地区：[1]中国电子科技集团公司第三十八研究所,安徽合肥230088

出　　处：《电子测试》2017年第6期23-25,共3页Electronic Test

摘　　要：为了深入解决TPM刀片式板卡插箱在低压和高湿热环境下的散热问题,采用器件级底层高效导热结合外层扩散热沉/风冷的半封闭式设计方式,规避了恶劣环境对发热器件的腐蚀干涉,器件法兰预埋钼铜载体有效降低了热点幅度,同时利用工程热分析软件进行多次热仿真及迭代计算,验证了该插箱热设计的有效性,为上游结构设计提供有力的技术支撑,并给类同散热问题借鉴参考。In order to solve the heat dissipation problem of TPM blade type board plug box at low and high in hot and humid environment, the device level high thermal conductivity of semi closed design combined with outer diffusion heat sink/air cooling, avoid the corrosion environment of the heating device interference device, flange embedded molybdenum copper can reduce the hot carrier amplitude？ At the same time using the thermal analysis software for multiple heat engineering calculation and simulation, to verify the validity of the plug box thermal design, and provides strong technical support for the upper structure design, and give reference to similar heat problem？

关 键 词：插箱 刀片式板卡 热流密度 低压 

分 类 号：TN02[电子电信—物理电子学]