烧结工艺对电容式高温压力传感器用氧化铝陶瓷基片的影响  

Effects of Sintering Process on Alumina Ceramic Substrate for Capacitance of High Temperature Pressure Sensor

作　　者：王辰[1] 石金访 徐梁格 马超[1] 王鹏飞[1] 张钰[1] WANG Chen SHI Jinfang XU Liangge MA Chao WANG Pengfei ZHANG Yu(School of Materials Science and Engineering, Jilin Institute of Chemical Technology, Jilin 132022, China School of Materials Science and Engineering Changchun University of Technology, Changchun 130012, China College of Material Science and Chemical Engineering, Harbin Engineering University, Harbin 150001, China)

机构地区：[1]吉林化工学院材料科学与工程学院,吉林132022 [2]长春工业大学材料科学与工程学院,长春130012 [3]哈尔滨工程大学材料科学与化学工程学院,哈尔滨150001

出　　处：《中国陶瓷》2017年第7期51-54,60,共5页China Ceramics

基　　金：吉林省科技发展计划项目(20130102005JC);吉林省高等教育教学改革研究课题

摘　　要：为了研究不同烧结工艺对电容式高温压力传感器用氧化铝陶瓷基片的影响,以纳米α-Al_2O_3为主要原料,加入ZrO_2、MgO和Y_2O_3等粉料作为烧结助剂,采用流延成型、等静压成型和气氛保护无压烧结技术制备了氧化铝陶瓷基片。分别对试样的相对密度、抗弯强度、硬度及断裂韧性进行测试,并利用扫描电镜(SEM)观察其显微组织形貌。结果表明:陶瓷基片的烧结不宜接触O_2,因此在烧结过程中应选用流动高纯N_2对其进行气氛保护。为防止试样烧结后变形翘曲,基片在装载时应适度施加压盖,提高平整度。此陶瓷基片的理想烧结温度约为1550℃,对应试样的相对密度、抗弯强度、硬度及断裂韧性数值分别达到了98.8%、766 MPa、17.2 GPa及4.2 MPa·m^(1/2)。1550℃烧结试样显微组织呈现韧窝状,该结构有助于提高陶瓷基体的致密度及强韧化程度。In order to study the effects of different sintering process on alumina ceramic substrate for capacitance ofhigh temperature pressure sensor, A1203 ceramics substrate was prepared by tape casting, isostatic pressing and gasshield pressureless sintering with nano a-A1203 as the main raw material, and powders were added as sinteringadditives such as ZrO2, MgO and Y203. The relative density, bending strength, hardness and fracture toughness ofspecimens were tested, and microstructure was observed by scanning electron microscope （SEM）. The results show thatowing to the ceramic sintering is not suitable touching with 02, the flowing high purity N2 should be used to protectthe ceramic substrate during sintering process. In order to prevent the deformation of specimen after sintering, thesubstrate should be moderately applied pressure to improve the flatness at loading. The ideal sintering temperature ofthe ceramic substrate is about 1550 ℃ . The relative density, flexural strength, hardness and fracture toughness of thecorresponding specimens was 98.8%, 766 MPa, 17.2 GPa and 4.2 MPa. m/2, respectively. The specimens of 1550 Uhave dimple microstructure, which is helpful to improve the density and toughening degree of ceramic matrix.

关 键 词：氧化铝陶瓷 基片 烧结工艺 传感器 力学性能 

分 类 号：TQ174.6[化学工程—陶瓷工业]