便携式密闭终端设备的散热设计及仿真分析  

Thermal Design and Simulation Analysis for a Portable Sealed Terminal Equipment

作　　者：彭伟[1] 王虎军[1] 陆景松[1] 王志海[1] 

机构地区：[1]中国电子科技集团公司第三十八研究所,安徽合肥230088

出　　处：《电子测试》2017年第7期32-33,27,共3页Electronic Test

摘　　要：为了有效解决便携式终端设备在密闭结构形态下的散热问题,通过针对T/R组件芯片底部预埋钼铜载体、FPGA和DSP局部热点生长导热凸台等一系列方法打通了设备散热路径,优化了设备内部环境热场,并借助工程热仿真平台分析验证了设备散热设计的有效性,为今后类同便携式密闭设备的热设计提供了参考。In order to solve the heat dissipation problem of portable terminal equipment in a confined structure, through to the bottom of the chip embedded T/R components FPGA and DSP molybdenum copper carrier, local hot growth heat boss and a series of methods to open up the equipment cooling path, optimize the internal environment of equipment thermal field, and with the analysis of engineering thermal simulation platform is proved to be effective the design of cooling equipment, which provides a reference for the thermal design of the future similar portable airtight equipment.

关 键 词：便携式 密闭设备 芯片温度 局部热点 

分 类 号：TN02[电子电信—物理电子学] TP391.9[自动化与计算机技术—计算机应用技术]