基于仿真的大功率功放模块强迫风冷散热结构设计  

Design of Forced Air Cooling Structure for Amplifier Module with High Power Based on Simulation

作　　者：李兵强[1] 刘新博[1] 冯昕罡[1] 

机构地区：[1]中国电子科技集团公司第二十研究所,陕西西安710068

出　　处：《舰船电子对抗》2017年第3期99-103,共5页Shipboard Electronic Countermeasure

摘　　要：某数据链设备的功放模块发热问题比较突出,常温工作即发生热保护。分析了该功放模块原散热结构存在的问题,对其进行了改进设计。设计过程中应用热仿真软件辅助分析,建立了模块的热仿真模型,分析了常温和高温工作时模块散热性能。最后对常温散热性能进行了热测试,验证了仿真模型的准确性,表明改进后的模块散热结构方案有效可行。The heating problem of power amplifier module of a certain data link equipment is more serious,and the thermal protection occurs in working at normal temperature. This paper analyzes the existing problems of the original heat dissipation structure of the power amplifier module and performs improvement design. In the design process,the thermal simulation software is used to as-sist the analysis, and the thermal simulation model is established, as well as the heat dissipation performance is analyzed in working at normal temperature and high temperature. Finally, the heat dissipation performance at normal temperature is tested,and the accuracy of the simulation model is verified,which shows that the improved project is effective and feasible.

关 键 词：功放模块 热仿真 强迫风冷 

分 类 号：TN03[电子电信—物理电子学]