基于热电制冷技术的一体化高效冷却机箱  

Integrated High-efficient Cooling Chassis Based on Thermoelectric Cooling

作　　者：梅源[1] 方晓鹏[1] 束瑛[1] MEI Yuan FANG Xiao-peng SHU Ying(Nanjing Research Institute of Electronics Technology, Nanjing 210039, China)

机构地区：[1]南京电子技术研究所,江苏南京210039

出　　处：《电子机械工程》2017年第3期48-52,共5页Electro-Mechanical Engineering

摘　　要：随着器件集成度的不断提高,电子设备机箱内板卡的热耗越来越大,不同板卡间热耗差异增大,对机箱的冷却设计提出了更高的要求。传统的冷却方式(如:常规风冷,常规液冷等)不能满足机箱新的冷却需求;若采用空调风冷则需要增大设备体积,不满足结构紧凑的要求。文中提出了利用热电制冷技术来解决此类机箱的冷却问题。通过仿真优化设计了一种一体化高效冷却机箱,并对机箱的冷却效果进行了实验验证。结果表明:该一体化高效冷却机箱满足结构和冷却需求,为未来的电子设备机箱冷却设计提供了一种新的思路。In order to solve the problem of high density of sheet plate and high heat consumption oi single plate, an efficient cooling is needed. Sometimes traditional passive cooling methods, i.g. wind cooling, liquid cooling, can not solve the problem lonely, but other active cooling methods like air conditioning are also nee- ded . To solve the problems air condition faced , such as heat imbalance , too high partial heat flux density in electronic equipment chassis, an integrated high efficient cooling chassis is designed using thermoelectric cool- ing technology. This design is proved to fesible by simulation and experiment. It provides an innovative design choice for the future chassis cooling.

关 键 词：电子设备机箱 一体化设计 热电制冷 高热流密度 

分 类 号：TK124[动力工程及工程热物理—工程热物理]