Cu对纯铝铝箔组织及性能的影响  

Effect of Cu on microstructure and properties of pure aluminum foil

作　　者：曹瑞珂[1] 岳有成[1] 谭国寅[1] 杨钢[1] 马宁 何慧刚 

机构地区：[1]昆明冶金研究院,云南昆明650503 [2]云南省浩鑫铝箔有限公司,云南昆明650216

出　　处：《金属热处理》2017年第7期74-75,共2页Heat Treatment of Metals

基　　金：云南省应用基础研究重大项目(2013FC010)

摘　　要：研究了Cu对纯铝铝箔组织及力学性能的影响。结果表明,添加0.5%Cu可使纯铝铝箔晶粒得到进一步细化,组织更加均匀一致,抗拉强度提高39%。经370℃×6 h退火后,由于Cu元素对位错的钉扎作用,有效阻碍了晶粒的长大,使铝箔塑性基本不变,抗拉强度提高67%。Effect of Cu on microstructure and mechanical properties of pure aluminum foil was studied. The results show that adding 0. 5%Cu can further refine grains of pure aluminum foil and make the microstructure more uniform,meanwhile the tensile strength is increased by39%. After annealing at 370 ℃ for 6 h,the plasticity of the aluminum foil is essentially the same but the tensile strength is increased by67%,due to the Cu addition can increase the dislocation pinning effect so that effectively prevented grain growth.

关 键 词：纯铝铝箔 CU 显微组织 力学性能 

分 类 号：TG166.3[金属学及工艺—热处理]