采用M_w可控的聚芳酯合成低成本耐高温聚氨酯胶粘剂  被引量:1

A low cost and high temperature resistant PU adhesive synthesized by Mw-controllable polyarylester

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作  者:李宁[1] 曲德智 张建军 霍锦钊 白永平[1] 

机构地区:[1]哈尔滨工业大学化工与化学学院,黑龙江哈尔滨150008 [2]佛山市南海高拓包装材料有限公司,广东佛山528225

出  处:《中国胶粘剂》2017年第7期32-36,共5页China Adhesives

摘  要:以BPA(双酚-A)/NaOH(氢氧化钠)水溶液、BTEAC(苄基三乙基氯化铵)、4,4-二羧基二苯醚/二氯甲烷溶液为原料,采用相转移界面缩聚法室温合成了新型PAR(聚芳酯);然后以此为软段、MDI(4,4-二苯基甲烷二异氰酸酯)为硬段,制备双组分PU(聚氨酯)耐高温胶粘剂。研究结果表明:当n(NaOH)∶n(BPA)=2.4∶1、反应时间为24 h时,PAR的M_w相对最大(为130 000);新型双组分PU胶粘剂的热分解温度(350℃)和600℃残炭率(35%)均明显高于传统PU胶粘剂(165℃、8%),并且其在m(甲组分)∶m(乙组分)=100∶90时具有相对最佳的凝胶时间、高温粘接性能和高温力学性能。With BPA (bisphenol- A)/NaOH (sodium hydroxide) aqueous solution, BTEAC (benzyl triethyl ammonium chloride) , 4, 4-dicarboxyl diphenyl ether/dichloromethane solution as raw materials, a new PAR (polyarylester) was synthesized by phase transfer interface polycondensation at room temperature. Then, with PAR as soft chain segment, MDI (4, 4-diphenyl methane diisocyanate) as hard chain segment, a two-component high temperature resistant PU (polyurethane) adhesive was prepared. The research results showed that the PAR's Mw was relatively maximal ( 130 000) when molar ratio of n (NaOH) :n (BPA) was 2.4: 1, and reaction time was 24 h. The thennal decomposition temperature (350 ℃ ) and 600℃ carlton residue rate(35% ) of the new two-component PU adhesive were obviously higher than those of traditional PU adhesive ( 165 ℃, 8% ) , and it has the relatively optimal gel time, high temperature bonding properties and high temperature mechanical properties when mass ratio of m (first component) : rn (second component) was 100 : 90.

关 键 词:耐高温 胶粘剂 聚氨酯 聚芳酯 重均相对分子质量 可控 

分 类 号:TQ433.432[化学工程]

 

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