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作 者:Ying Lu Liang Shen Jiabo Wang Ya Shen
机构地区:[1]Nanjing Electronic Device Institute
出 处:《Journal of Semiconductors》2017年第8期69-74,共6页半导体学报(英文版)
基 金:supported by the National Key Basic Research Program of China(No.2014CB339901)
摘 要:The GaAs-based TF-IPD fabrication process and equivalent lumped element circuit are utilized to re- duce the circuit size for double-section Wilkinson power divider. Ultimately the dimension of the proposed S-band power divider is reduced to 1.03 × 0.98 mm2. Its measured results show an operating fractional bandwidth of 54%, and return losses and isolation of greater than 20 dB. In addition the excess insertion loss is less than 1.1 dB. More- over the good features contain amplitude and phase equilibrium with the values of better than 0.03 dB and 1.5° separately. This miniaturized power divider could be widely used in RF/microwave circuit systems.The GaAs-based TF-IPD fabrication process and equivalent lumped element circuit are utilized to re- duce the circuit size for double-section Wilkinson power divider. Ultimately the dimension of the proposed S-band power divider is reduced to 1.03 × 0.98 mm2. Its measured results show an operating fractional bandwidth of 54%, and return losses and isolation of greater than 20 dB. In addition the excess insertion loss is less than 1.1 dB. More- over the good features contain amplitude and phase equilibrium with the values of better than 0.03 dB and 1.5° separately. This miniaturized power divider could be widely used in RF/microwave circuit systems.
关 键 词:thin film integrated passive device (TF-IPD) parameters extraction DE-EMBEDDING lumped element
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