便携式计算机加装辅助散热片降温效能分析  

Analysis of Cooling Performance for Notebook Computer with Auxiliary Heat Sink

作　　者：杨晨光[1] 邵宝东[1] 王丽凤[1] 杨洋[1] 

机构地区：[1]昆明理工大学建筑工程学院,昆明650500

出　　处：《价值工程》2017年第26期118-121,共4页Value Engineering

基　　金：国家自然科学资助项目(11462010)

摘　　要：随着计算机性能的提升,许多型号的笔记本电脑原装散热系统已经不能满足用户需要.在高发热区域加装小型散热片已成为非常广泛的散热改造方式.本文通过有限元分析方法对加装小型散热片的计算机元件在不同风流环境中进行了数值模拟.模拟结果表明,当目标原件位置风速较大时,加装了散热片的芯片可以起到一定的降温作用;在风力较弱时,加装小型散热片对电脑原件的降温效果不明显.小型散热片对元件升温速率基本无影响。With the improvement of computer performance, many models of the laptop＆#39;s original cooling system has been unable to meet user needs. Installing a small heat sink in the high heat area has become a very popular cooling method. In this paper, the computer components with small heat-sink are simulated in different airflow environment through the finite element analysis method. The simulation results show that the cooling chip can play a certain role when the original target is in the air duct; when the wind is weak; the cooling effect of the original computer is not obvious.

关 键 词：电脑芯片降温 数值模拟 流固耦合 

分 类 号：TK124[动力工程及工程热物理—工程热物理]