铜基上化学镀锡工艺分析  

Process analysis of electroless tin plating on copper substrate

作　　者：段富良 王梅 

机构地区：[1]云南锡业股份有限公司化工材料分公司,云南个旧661000

出　　处：《云南化工》2017年第6期76-78,共3页Yunnan Chemical Technology

摘　　要：介绍了铜基化学镀锡工艺技术及其特点,详细分析了铜基上化学镀锡中还原剂、促进剂、络合剂、防氧化剂等各种化学药剂作用。the technology and characteristics of electroless tin plating on copper substrate are introduced. The effects of various chemical agents such as reducing agent, accelerator, complexing agent and anti oxidant on electroless tin plating on copper substrate are analyzed in detail.

关 键 词：镀锡 铜基镀锡 化学镀锡 

分 类 号：TQ153.1[化学工程—电化学工业]