晶体硅光伏组件热斑失效问题研究  

THE STUDY ON HOT SPOTS FAILURE OF POLYCRYSTALLINE WAFER BASED PHOTOVOLTAIC MODULES

作　　者：张映斌[1,2] 夏登福[2] 全鹏[2] 冯志强[2] 杨平雄[1] 褚君浩[1] 

机构地区：[1]华东师范大学信息科学与技术学院极化材料与器件教育部重点实验室,上海200241 [2]光伏科学与技术国家重点实验室常州天合光能有限公司,常州213031

出　　处：《太阳能学报》2017年第7期1854-1861,共8页Acta Energiae Solaris Sinica

摘　　要：以不同反向漏电流等级的多晶硅太阳电池封装成的光伏组件和实际发生热斑失效的光伏组件为研究对象,通过数值模拟和实验研究的方法,对晶体硅光伏组件热斑失效的机理和规律进行理论分析与实验验证。研究结果表明:在阴影遮挡环境下被遮挡组件区域温度和太阳电池反向电流成正向相关性,即反向漏电流越大,组件温度越高;实验同时发现即使在完全无阴影遮挡的情况下,光伏组件也可能因组件封装过程中存在虚焊、空焊等接触不良连接点,形成微小间隙,引发电弧效应,从而导致严重的热斑失效。This work studies hot spot failure in photovohaic modules caused by high reverse-current leakage of solar cells and modules due to an internal arcing effect. Based on theory and demonstrated under experimental testing of modules with high leakage current cells, a positive correlation was found under s temperature of the shaded area and reverse leakage current. Through continued analysis, hading conditions between the simulation, and experiments on modules showing hot spot failure in photovohaic power plants, it is also discovered that even in the absence of shading, thermal stresses caused by variances in day-night temperature in combination with poor soldering connections may form small gaps and cause an arcing effect, which can lead to severe hot spot failure.

关 键 词：光伏组件 热斑失效 反向漏电流 接触不良 电弧效应 

分 类 号：TK51[动力工程及工程热物理—热能工程]