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作 者:焦淑敏 JIAO Shumin(Pinggao Group Co., Ltd., Henan Pingdingshan 467001, China)
出 处:《高压电器》2017年第8期61-66,共6页High Voltage Apparatus
摘 要:文中工作的开展是为了解决高压断路器小型化或增容设计时带来的温升问题。在综合考虑绝缘件的介质损耗、筒体涡流损耗、接触电阻、集肤效应、热传导、自然对流和辐射等因素的基础上,建立了高压断路器的三维电磁场与流场耦合发热仿真模型,采用Ansys和Fluent进行求解,分析了温度分布趋势,研究了集肤效应、介质损耗、涡流和辐射等因素对温升计算的影响。结果表明:集肤效应、接触电阻、筒体表面的辐射对温升计算影响较大,而铝合金壳体的涡流损耗与绝缘件的介质损耗可以忽略不计。最后对仿真结果进行了试验验证,最大相对误差为9.1%,满足工程设计精度要求,对断路器结构设计具有重要指导意义。The work of this paper is to solve the temperature rise problem in the high voltage circuit breaker min- iaturization or capacity lifting design. Three dimensional electromagnetic field and fluid field coupling simulation model is built by considering the dielectric loss of the insulated parts, the eddy current loss, the contact resistance, the skin effect,the heat conduction,the natural convection and the radiation,etc.Ansys and Fluent are used, the temperature distribution is analyzed and the influence of the skin effect,the dielectric loss, the eddy current loss and the radiation on temperature rise calculation is studied. The conclusion is:the skin effect, the contact resistance, the radiation of cylinder surface have large impact of temperature simulation, however, the eddy current loss of aluminum alloy casing and the dielectric loss of the insulating body is negligible. In addition,the simulation results are compared to temperature rise measurements,and the maximum relative error is 9.1% ,which has acceptable engineering accuracy and important guiding significance for the structure design of circuit breaker.
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