多尺度复合热界面材料研究进展  

Research Progress of Multi-scale Composite Thermal Interface Materials

作　　者：毛琳[1] 赵迪[1] 邹雄[1] 王金合[1] 施利毅[1] 

机构地区：[1]上海大学纳米科学与技术研究中心,上海200444

出　　处：《绝缘材料》2017年第8期9-13,21,共6页Insulating Materials

基　　金：国家自然科学基金资助项目(51403123)

摘　　要：热界面材料是电子器件热管理的重要部分,对降低界面热阻、提高散热效率至关重要。本文从导热填料的粒径复配、填料之间的界面热阻以及新兴二维高导热填料的应用3个角度对多尺度复合热界面材料的研究进展进行了综述,提出了高性能热界面材料未来重要的研究方向。Thermal interface material is an important part of thermal management for electronic devices, and it is crucial for reducing the interface thermal resistance and improving the heat dissipation efficien- cy. In this paper, the research progress of multi-scale composite thermal interface materials was reviewed from the mixture of thermal conductive fillers with different particle sizes, the interface thermal resistance among fillers, and the applications of new two-dimensional high thermal conductive fillers. The research directions of high performance thermal interface materials were proposed.

关 键 词：热界面材料 多尺度复合 界面热阻 二维高导热填料 

分 类 号：TM215[一般工业技术—材料科学与工程]