电子封装用Al-30Si合金的CMT焊工艺研究  

Study on CMT Welding Process of Al-30Si Alloy for Electronic Packaging

作　　者：吴铭方[1] 刘向阳 王凤江[1] 李东洋[1] 

机构地区：[1]江苏科技大学材料科学与工程学院,江苏镇江212000 [2]镇江镨利玛新型材料科技有限公司,江苏镇江212121

出　　处：《热加工工艺》2017年第15期179-182,共4页Hot Working Technology

摘　　要：高硅铝合金是一种轻质材料,具有良好的导电性、低的热膨胀系数、稳定的化学性质、良好的机加工性能,在电子信息行业和航空航天中得到了广泛的应用。从焊缝的微观组织、焊缝成型、焊缝气孔率、硬度等四个方面研究不同工艺参数下Al-30Si合金的CMT焊接性能。送丝速度3.0 m/min、焊接速度500 mm/min是Al-30Si合金CMT焊接的最佳参数。The high silicon aluminum alloy is a light weight material with good ＂electrical conductivity, low thermal expansion coefficient, stable chemical property, and good machining performance, and it has been widely used in the electronic information industry and aerospace application. The CMT welding properties of AI-30Si alloy under different process parameters were studied from aspects of weld microstructure, weld forming, weld porosity and hardness. The wire feeding speed of 3.0 m/min, and welding speed of 500 mm/min are the best parameters of Al-30Si alloy CMT welding.

关 键 词：高硅铝合金 CMT焊接 焊缝气孔 送丝速度 焊接速度 

分 类 号：TG444.7[金属学及工艺—焊接]