固溶温度对新型铜基模具材料性能的影响  

Effects of Solid Solution Temperature on Properties of New-typed Copper-based Die Material

作　　者：李强伟[1] 华小红[2] 

机构地区：[1]苏州大学工程训练中心,江苏苏州215021 [2]苏州工业园区职业技术学院,江苏苏州215021

出　　处：《热加工工艺》2017年第16期179-181,共3页Hot Working Technology

基　　金：国家自然科学基金项目(61272210);江苏省自然科学基金项目(BK2011417)

摘　　要：采用6种不同温度对Cu-Al-Mn-Sr-In新型铜基模具材料试样进行了固溶处理,并测试了热疲劳性能和不同环境下的耐磨损性能。结果表明:随固溶温度从825℃升高至950℃,材料的耐磨损性能和热疲劳性能均先提高后下降,固溶温度优选为900℃。与825℃固溶相比,900℃固溶时材料的磨损体积减小81.4%,热疲劳裂纹级别从11级变为2级。The solid solution treatment of Cu-Al-Mn-Sr-In new-typed copper based die material samples was carried out by using 6 different temperatures. And the thermal fatigue properties and wear resistance under different environments were tested. The results show that with solid solution temperature increasing from 825 ℃ to 950 ℃, the wear resistance and thermal fatigue property of the material firstly increase and then decrease. The optimized solid solution temperature is 900 ℃.Compared with the solid solution at 825 ℃, the wear volume of the material is decreased by 81.4% and the thermal fatigue crack grade changes from 11 level to 2 level when solid solution temperature is 900 ℃.

关 键 词：固溶温度 铜基模具材料 耐磨损性能 热疲劳性能 

分 类 号：TG156.94[金属学及工艺—热处理]