谈硫酸盐光亮镀铜的可溶性阳极  

Discussion about Soluble Anode in Bright Sulfate Copper Plating Process

作　　者：程良 周腾芳 

机构地区：[1]上海浦疆科技工程公司,上海310116 [2]佛山市承安铜业有限公司,广东佛山528203

出　　处：《印制电路信息》2017年第9期20-23,共4页Printed Circuit Information

摘　　要：文章介绍电镀铜可溶性阳极对纯度、物理状态、溶解性能、阳极形状等的要求,并就PCB电镀使用低磷微晶磷铜阳极材料的优点进行分析。The requirements of purity, material state, solubility and shapes of anode were introduced for soluble anode in copper plating on this paper, and the advantages of icrocrystalline phosphorous copper anodes with low phosphor for PCB manufacturing were analyzed.

关 键 词：光亮镀铜 低磷微晶磷铜阳极 印制电路板 

分 类 号：TN41[电子电信—微电子学与固体电子学]