解读光亮抗锡疫、抗蠕变、抗锡晶须板的制备过程  

Preparative process for shiny electrolytic tinplate with antitin disease creep resistance and anti-whisker

作　　者：刘镇权 邬通芳 

机构地区：[1]广东成德电子科技股份有限公司,广东佛山528300

出　　处：《印制电路信息》2017年第9期29-38,共10页Printed Circuit Information

摘　　要：介绍锡疫、蠕变、锡晶须产生及AWA添加剂在电镀锡作用,用它生产的镀锡板具有很好抗锡疫、抗蠕变、抗锡晶须的功能,并具有极佳的焊点完整性/可靠性、极佳的抗腐蚀性能、完美的可焊性、离子污染少、不含无卤素和无铅、高出料率,是HASL的最理想替代产品。This paper introduced productive conditions of tin disease, creep deformation, tin-crystal whisker which take place as well as the function of AWA additive in electrolytic tinplate in detail in the text. Electrolytic tinplate possesses higher anti-tin disease, creep resistance and anti-whisker function and has excellent solder joint integrity/reliability, excellent corrosion resistance, perfectly solderability, lower ionic pollution, lead free and halogen-free, higher discharge rate, which is perfect alternative of HASL.

关 键 词：抗锡疫 抗蠕变 抗锡晶须 高加速寿命测试 高加速应力筛选 

分 类 号：TN41[电子电信—微电子学与固体电子学]