预处理的优化与计算机结果分析  

Optimization of Pretreatment Process and Result Analysis

作　　者：田娟[1] 于兴艳[1] 

机构地区：[1]克拉玛依职业技术学院,新疆克拉玛依834000

出　　处：《当代化工》2017年第8期1702-1704,共3页Contemporary Chemical Industry

摘　　要：化学镀方法较电镀方法更适合于在微米级颗粒表面镀覆突起的刺状金属镀层。通过调整镀液组成和施镀工艺参数,得出亲水性和化学镀工艺参数是影响人造金刚石表面化学镀镍磷合金形貌的主要因素。结果表明为了确保人造金刚石表面呈现良好的亲水性,实现中应该采用镀液能够很好的润湿与接触;在电镀化学过程中采用铬酸洗液可以实现金刚石表面的活性提高,这一结果对于微纳量级的金刚石顺利电镀非常关键。Electroless plating method is a plating method that is more suitable for the micron grade particle surface plating process of spiny metal coating. In this research, the composition of plating solution and plating process parameters were analyzed, it＇s concluded that the hydrophilicity and electroless plating process parameters are main reasons to affect the surface morphology after electroless Ni-P alloy plating on synthetic diamond furnace. The experimental results show that, in order to ensure good hydrophilicity of synthetic diamond surface, chromic acid solution should be used in the process of chemical plating to improve the activity of the diamond surface, which is critical for micro-nano diamond electroplating.

关 键 词：预处理 微米级金刚石 电镀 

分 类 号：TQ23[化学工程—有机化工]