回复与再结晶退火对新型HSn70-1黄铜组织及性能的影响  

Influence of Recovery and Recrystallization Annealing on Microstructure and Properties of New HSn70-1 Brass

作　　者：黄立龙[1] 王聪兴 刘新宽[1] 刘平[1] 陈小红[1] 梅品修 李伟[1] 马凤仓[1] 何代华[1] 

机构地区：[1]上海理工大学材料科学与工程学院,上海200093 [2]河南省工业学校,河南郑州450003 [3]上海咏凌合金材料有限公司,上海201802

出　　处：《有色金属材料与工程》2017年第4期215-221,共7页Nonferrous Metal Materials and Engineering

基　　金：上海市科委基础重点项目(10JC1411800)

摘　　要：设计了一种新型HSn70-1黄铜合金,其冷拉拔加工率为55%.应用偏光显微镜、X射线衍射仪、扫描电子显微镜、显微硬度计、万能材料试验机和电化学工作站等设备,研究了不同的退火温度对新型合金显微组织和性能的影响.结果表明:加入少量Sn,Al,P,Ni合金元素构成了新型HSn70-1合金,合金元素以固溶体的形式存在于晶粒内部,其组织为α单相;合金在不同温度下保温2 h,200℃时发生应变时效,300~450℃为再结晶过程,450~550℃为晶粒长大阶段,550~600℃晶粒基本完全长大.随着退火温度的升高,合金的硬度、抗拉强度和屈服强度逐渐降低并趋于缓慢,其伸长率变化相反;合金自腐蚀电流密度、失重率逐渐降低并趋于稳定;开路电位逐渐变大,最后趋于稳定,新型HSn70-1黄铜的耐腐蚀性逐渐变好.A new HSn70-1 brass was designed and processed by cold drawing deformation of 55%. Such as polarizing microscope, XRD？ SEM？ micro hardness meter instruments, universal material tester, electrochemical workstation,etc. were used to analysis the influence of the microstructure and property of the new alloy at different annealing temperature. The results show that the new HSn70-l brass is made of a small amount addition alloy including Sn？Al？P and Ni. The four alloying elements totally exist in the form of solid solution in the grain and its structure isa-phase. After the alloy was annealed at different temperatures for 2 hours, the new alloy is strained at 200 °C and the recrystallization is from 300 °C to 450 °C . Subsequently, the temperature of grain growth is from 450 °C to 550 °C and the grain grow up completely at 550-600 °C . With the increase of annealing temperature, the hardness, tensile strength and yield strength of the alloy decrease gradually and tend to be a stabilizing value. However the trend of the elongation is completely opposite. The self-corrosion current density and weight loss rate gradually reduce, and tend to be a stable value. Open circuit potential gradually become larger and eventually stabilized, and the corrosion resistance of new HSn70-l brass gradually improved.

关 键 词：新型HSn70-1黄铜 回复与再结晶退火 显微组织 失重率 电流密度 

分 类 号：TG146.11[一般工业技术—材料科学与工程] TG166.2[金属学及工艺—金属材料]