Cu粉粒径对PEEK/Cu导热复合材料性能的影响  

Effect of Cu Particle Size on the Properties of PEEK/Cu Thermal Conductive Composites

作　　者：宁洋[1] 孙诗良 曲敏杰[1] 吴立豪 乔占凤 万长宇 

机构地区：[1]大连工业大学纺织与材料工程学院,辽宁大连116034 [2]大连路阳科技开发有限公司,辽宁大连116600

出　　处：《塑料科技》2017年第9期25-28,共4页Plastics Science and Technology

基　　金：国家"863"计划(92015AA033803);2015辽宁省研究生联合培养项目(辽教发[2015]114号;81421909)

摘　　要：以铜(Cu)粉为导热填料,采用模压法制备了聚醚醚酮(PEEK)/Cu导热复合材料,并研究了铜粉粒径对PEEK/Cu导热复合材料导热性能、力学性能及结晶性能的影响。结果表明:随着Cu粉粒径的增大,PEEK/Cu导热复合材料的力学性能逐渐下降;当Cu粉粒用量为30%、粒径为10μm时导热复合材料的导热系数达到最佳值0.396 W/(m·K),相比于纯PEEK提高了67.80%;熔融焓与结晶度随着Cu粉粒径的增大而逐渐减小,因而PEEK/Cu导热复合材料的结晶性能降低。Poly（ether ether ketone）（PEEK）/Cu thermal conductive composites were prepared by compression molding with the copper powder as conductive filler. The effects of Cu particle size on the thermal conductivity, mechanical properties and crystallization properties of PEEK/Cu heat conductive composites were investigated. The results show that： with the increase of Cu particle size, the mechanical properties of PEEK/Cu thermal conductive composites decrease gradually. When the amount of Cu powder is 30% and the particle diameter is 10 μm, the optimum thermal conductivity of PEEK/Cu composite is 0.396 W/（m· K）, which is 67.80%, higher than that of pure PEEK. The melt enthalpy and crystallinity decrease with the increase of Cu particle size, so the crystallization properties of PEEK/Cu composites decrease.

关 键 词：聚醚醚酮 铜粉粒径 导热复合材料 

分 类 号：TB333[一般工业技术—材料科学与工程]