TC4钛合金扩散连接工艺研究  

Study on Diffusion Bonding Process of TC4 Titanium Alloy

作　　者：何辰佳 陈明和[1] 谢兰生[1] 

机构地区：[1]南京航空航天大学机电学院,江苏南京210016

出　　处：《热加工工艺》2017年第17期64-68,共5页Hot Working Technology

摘　　要：通过正交试验研究了TC4钛合金的真空扩散连接工艺,进行了扩散连接接头的剪切强度试验。通过光学显微镜(OM)、扫描电镜(SEM)等分析手段,研究扩散连接温度、压力、时间等参数对TC4真空扩散连接质量及扩散连接接头剪切强度的影响。结果表明:扩散连接温度920℃,压力3 MPa,保温保压30 min时,扩散连接界面完全与基体相融,局部微孔等缺陷基本消失,孔洞弥合率达到98.63%,扩散连接接头的剪切强度为467.83 MPa,达到了母材剪切强度(480MPa)的97.46%。The vacuum diffusion bonding process of TC4 titanium alloy was studied by means of orthogonal test, and the shear strength of diffusion bonding joints was tested. The influence of the bonding temperature, pressure and time on the vacuum diffusion bonding quality and the shear strength of TC4 joints was investigated by means of optical microscope and scanning electron microscope. The results show that when the diffusion bonding temperature is 920 ℃, the pressure is 3 MPa and the time is 30 min, the diffusion bonding interface merges fully into the base metal, and local voids and other defects almost disappear. The percent of bonded area reaches 98.63%, and the shear strength of the joint is 467.83 MPa, which reaches 97.46% that of the base metal （480 MPa）.

关 键 词：TC4 扩散连接 剪切强度 扩散连接温度 连接压力 连接时间 

分 类 号：TG453.9[金属学及工艺—焊接]