激光打孔加工研究的现状分析  

Analysis of laser drilling processing

作　　者：金锐超[1] ZHANG Yi-zhen ZHOU Bei-lei 

机构地区：[1]渭南职业技术学院,陕西渭南714000 [2]Weinan Vocational and Technical College [3]Maternal and child health care hospital of Linwei Weinan District

出　　处：《科技视界》2017年第14期134-134,39,共2页Science & Technology Vision

基　　金：基金项目 服务“中国制造2025”的汽车检测与维技术专业人才培养模式研究;委托单位:渭南职业技术学院

摘　　要：激光加工工艺是一项复杂的,任务很艰巨的技术,需要我们不断的优化激光加工参数,提高与完善加工工艺以实现激光超精细加工,本文介绍了激光加工的理论、加工工艺、飞秒激光加工的国内研究现状,总结了目前激光打孔的不足,为未来激光打孔的研究方向提供思路。Laser processing technology is a very complex and very difficult task, need to be continuously optimized laser processing parameters , increased to achieve laser fine processing and improved the processing technology, this paper introduces the domestic research status of laser processing theory, processing technology, femtosecond laser processing, summarizes the advantages of femtoseeond laser drilling. The shortcomings of laser drilling are summarized, which provides the direction for the future research of laser drilling.

关 键 词：飞秒激光 激光打孔 激光加工系统 

分 类 号：TG665[金属学及工艺—金属切削加工及机床]