对苯二酚抗氧化剂对甲基磺酸盐电镀锡板性能的影响  

Influence of Hydroquinone Antioxidant on Performance of MSA Electroplating Tinplate

作　　者：李萍[1] 李晓东[1] 蒯珊 王文将 张千峰[1] 

机构地区：[1]安徽工业大学分子工程与应用化学研究所,安徽马鞍山243002

出　　处：《材料保护》2017年第8期47-49,共3页Materials Protection

基　　金：校企产学研联合科技攻关项目资助

摘　　要：甲基磺酸盐镀锡液是一种性能良好的新型镀锡体系,目前有关抗氧化剂对苯二酚对甲基磺酸盐电镀体系影响的研究还不系统。为此,主要通过阴极极化曲线、交流阻抗和中性盐雾试验等测试及评价方法,研究了对苯二酚抗氧化剂对镀液性能及锡镀层耐蚀性的影响。结果表明:对苯二酚抗氧化剂对镀液及锡镀层综合性能的影响较为明显,当镀液中对苯二酚抗氧化剂加入质量分数为0.2%时,沉积锡电位较低,极化电阻最大,表明阴极极化能力最强,锡镀层有较低的孔隙率及较好的耐蚀性。The influence of hydroquinone antioxidant on the performance of plating solution and corrosion resistance of coating was studied by the methods of cathodic polarization curve,Tafel polarization curve,alternating-current impedance and neutral salt spray test.Results showed that the hydroquinone antioxidant had obvious effects on both plating solution and tinplate.Especially,when 0.2% hydroquinone antioxidant was added to the tin plating electrolyte,the lower position of the corrosion potential and the maximum polarization resistance were achieved.The results of which indicated that the polarizing capability of cathode was the strongest,and the tin plating had lower porosity and superior corrosion resistance.

关 键 词：电镀锡 甲基磺酸盐 对苯二酚 抗氧化剂 孔隙率 耐蚀性 

分 类 号：TQ153.13[化学工程—电化学工业]