基于冗余结构的大功率电镀电源设计  

Design of High-Power Electroplating Power Supply Based on Redundancy Structure

作　　者：黄河清[1] 

机构地区：[1]重庆电子工程职业学院物联网学院,重庆401331

出　　处：《电镀与环保》2017年第5期47-49,共3页Electroplating & Pollution Control

摘　　要：基于冗余结构,采用模块化思路设计出一种大功率电镀电源。由多个分散的模块电源构成并机系统,能根据负载需求灵活配比电源,利用STM32主控芯片和FPGA芯片组成集中控制系统实现均流控制,并利用FPGA芯片保证所有功率模块的同步性。该电镀电源具有成本低、控制精度高、可靠性强等优点,能够满足电镀工艺发展对电镀电源提出的要求。A high-power electroplating power supply was designed using modular destgn idea based on redundancy structure. It was composed of multiple decentralized module power supply, which constitute parallel controller system, and can flexible matching power supply according to the load demand. Current sharing control was realized utilizing the centralized control system which was composed of STM32 main control chip and FPGA chip, and synchronism of all the modules was guaranteed utilizing FPGA chip. This electroplating power supply has the advantages of low cost, high control precision and high reliability, can meet the requirements of electroplating process development for electroplating power supply.

关 键 词：电镀电源 大功率 冗余结构 功率单元模块 均流控制 

分 类 号：TM92[电气工程—电力电子与电力传动]