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机构地区:[1]Microelectronics Department North China University of Technology [2]Key Laboratory of Microelectronics Devices & Integrated Technology Institute of MicroelectronicsChinese Academy of Sciences [3]School of Microelectronics University of Chinese Academy of Sciences
出 处:《Chinese Physics B》2017年第10期453-458,共6页中国物理B(英文版)
基 金:supported by the National Natural Science Foundation of China(Grant Nos.61574168 and 61504163)
摘 要:The growth process of GeOx films formed by plasma post-oxidation (PPO) at room temperature (RT) is investigated using angle-resolved x-ray photoelectron spectroscopy (AR-XPS). The experimental results show that the distributions of the Ge4+ states, a mixture of the Ge^2+ and Ge^3+ states, and the Ge^1+ states are localized from the GeOx surface to the GeOx/Ge interface. Moreover, the Ge^1+ states are predominant when the two outermost layers of Ge atoms are oxidized. These findings are helpful for establishing in-depth knowledge of the growth mechanism of the GeOx layer and valuable for the optimization of Ge-based gate stacks for future complementary metal-oxide-semiconductor (MOS) field-effect transistor (CMOSFET) devices.The growth process of GeOx films formed by plasma post-oxidation (PPO) at room temperature (RT) is investigated using angle-resolved x-ray photoelectron spectroscopy (AR-XPS). The experimental results show that the distributions of the Ge4+ states, a mixture of the Ge^2+ and Ge^3+ states, and the Ge^1+ states are localized from the GeOx surface to the GeOx/Ge interface. Moreover, the Ge^1+ states are predominant when the two outermost layers of Ge atoms are oxidized. These findings are helpful for establishing in-depth knowledge of the growth mechanism of the GeOx layer and valuable for the optimization of Ge-based gate stacks for future complementary metal-oxide-semiconductor (MOS) field-effect transistor (CMOSFET) devices.
关 键 词:Ge plasma post-oxidation MOS XPS
分 类 号:TN386[电子电信—物理电子学]
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