光纤激光掩膜微细电解复合加工装置研发  

Development of the device for electrochemical micro machining with fiber laser masking

作　　者：李小海[1] 王淑铭 王冬[1] 佟晗[1] 

机构地区：[1]佳木斯大学机械工程学院,黑龙江佳木斯154007 [2]佳木斯大学材料科学与工程学院,黑龙江佳木斯154007

出　　处：《制造技术与机床》2017年第10期22-26,共5页Manufacturing Technology & Machine Tool

基　　金：国家自然科学基金项目(51375208);佳木斯大学科技创新团队项目(Cxtdpy-2016-04)

摘　　要：微小型金属工件的高效微细加工技术是困扰现代制造业的一个难题。采用光纤激光器在304不锈钢表面以直写方式进行表面改性处理,在不锈钢表面生成金属氧化层,形成抗腐蚀性保护掩膜,再将激光表面改性技术与微细电解加工技术相结合,利用简单片状工具电极通过微细电解加工,完成复杂微结构加工。为此研制了一套激光掩膜微细电解加工装置,开发了专用激光掩膜微细电解电源,并加工出典型微结构型腔样件,为进一步探索激光掩膜微细电解加工新工艺奠定基础。It is a difficult problem for modern manufacturing industry to machine micro metal parts with high efficiency. The oxidation layer on the 304 stainless steel surface can be formed by fiber laser masking in manner of direct writing,which is protective corrosion resistance mask. By combining laser surface modification with electrochemical micro machining（ EMM）,a simple foil electrode can fabricate complex micro structures on the surface of stainless steel. A device of EMM with laser masking was developed,which is equipped with a special power supply. Some samples with typical structure were fabricated by EMM with laser masking,laying the basis for exploring the new technology of EMM with laser masking.

关 键 词：光纤激光 微细加工 电解加工 掩膜 加工装置 

分 类 号：TG662[金属学及工艺—金属切削加工及机床] TG665