Mo/AgCuTi/Cu钎焊接头的界面结构及连接机理  

Interfacial Structure and Bonding Mechanism of Mo/AgCuTi/Cu Brazed Joint

作　　者：孙宁 周琦[2] 张德库[2] 顾非 孔见[2] 姚智 侯蔚 

机构地区：[1]中国兵器工业新技术推广研究所,北京100089 [2]南京理工大学材料科学与工程学院,江苏南京210094

出　　处：《热加工工艺》2017年第19期232-234,共3页Hot Working Technology

摘　　要：采用AgCuTi活性钎料实现了Cu和Mo的真空钎焊连接,获得了良好的钎焊接头。利用SEM、EDS等检测方法,分析了钎焊接头的界面结构和元素分布情况,并探讨了接头的连接机理。结果表明:Mo/AgCuTi/Cu接头的典型界面微观结构为Mo+Mo Ti固溶体+共晶组织+Cu基固溶体+富Ag区+Cu。在焊接过程中,Ti原子会在Mo侧偏聚形成Mo Ti固溶体从而降低界面能,使钎料能够润湿Mo母材实现焊接。The vacuum brazing tests of Cu and Mo were realized by using AgCuTi active filler metal, and good brazed joint was obtained. The interracial structure and element distribution of brazed joints were analyzed by means of SEM, EDS and other testing methods, and the bonding mechanism of the joint was discussed. The results show that the typical interracial microstructure of Mo/AgCuTi/Cu joints are Mo＋MoTi solid solution ＋ eutectic structure ＋Cu based solid solution ＋ rich Ag zone＋Cu. In the welding process, the Ti atoms are segregated at the side of Mo to form MoTi solid solution, thus reducing the interfacial energy, so that the solder can damp the Mo base metal and realize welding.

关 键 词：Cu/Mo钎焊 AgCuTi 界面结构 连接机理 

分 类 号：TG454[金属学及工艺—焊接]