钨粉级配法制备新型铜钨合金  

Preparation of New Copper-Tungsten Alloy by Grading Tungsten Powder

作　　者：邹军涛[1] 王媛媛[1] 杨晓红[1] 肖鹏[1] 梁淑华[1] Zou Juntao Wang Yuanyuan Yang Xiaohong Xiao Peng Liang Shuhua(Key Laboratory of Electrical Materials and Infiltration Technology, Xi＇an University of Technology, Xi＇an 710048, China)

机构地区：[1]西安理工大学陕西省电工材料与熔渗技术重点实验室,陕西西安710048

出　　处：《稀有金属材料与工程》2017年第9期2661-2666,共6页Rare Metal Materials and Engineering

基　　金：国家高技术研究发展计划("863"计划)(2015AA034304);国家自然科学基金(51401162;U1502274);陕西省科技计划(2014SZS08-Z01)(2015XT-16)

摘　　要：传统单一粒径钨粉制备的铜钨(CuW)合金难以满足电容器开关中高频次开断电触头的使用要求,本研究采用3种粒径钨粉(超微米、微米和亚微米)级配法制备了新型CuW合金,利用场发射扫描电镜对CuW合金组织特征进行显微分析,并对新型CuW合金耐电弧击穿性能进行研究。结果表明,钨粉级配制备CuW合金,能形成多种W-W烧结颈,强化钨骨架,熔渗Cu相更分散更均匀,从而使得CuW合金硬度、电导率均高出国家标准30%~40%,且CuW合金耐电压强度较高,此外,新型CuW/CrCu整体材料结合强度高出国家标准40%~60%。Traditional CuW alloy prepared by tungsten powder with single particle size is difficult to meet the requirement of electrical contact of the high-frequency switching capacitor switch. In this paper,tungsten powders with three kinds of particle size（supermicron,micron and submicron） were used to prepare novel CuW alloy. The microstructure of the CuW alloy was analyzed by field emission scanning electron microscopy and the arc breakdown properties were investigated. The results show that CuW alloy prepared by grading tungsten powders can form a variety of W-W sintered necks,which strengthen tungsten skeleton; therefore,distribution of the Cu phase becomes more uniform and more dispersed. As a result,the hardness and electrical conductivity of the CuW alloy is 30%~40% higher than the national standard,and the CuW alloy has a higher resistance of voltage strength. In addition,the bonding strength of the CuW/Cr Cu prepared by grading tungsten powder is 40%~60% higher than the national standard.

关 键 词：铜钨合金 级配 耐电压强度 结合强度 

分 类 号：TG146.411[一般工业技术—材料科学与工程]