纳米Cu颗粒对Sn-5Sb/Cu焊点微观组织及力学性能的影响  

Effects of nano Cu particles on microstructure and mechanical properties of Sn-5Sb/Cu solder joints

作　　者：丛少男 孙凤莲[1] 刘洋[1] 樊嘉杰 

机构地区：[1]哈尔滨理工大学材料连接应用省高校重点实验室,哈尔滨150080 [2]常州市武进区半导体照明应用技术研究院,常州213161

出　　处：《中国体视学与图像分析》2017年第2期158-165,共8页Chinese Journal of Stereology and Image Analysis

基　　金：国家高技术研究发展计划(863计划;No.2015AA033304)

摘　　要：本文基于体视学理论,借助PTR-1100型接合强度测试仪、DUH-211S超显微动态硬度计和扫描电镜设备,对Sn-5Sb-xnano Cu/Cu焊点微观组织及力学性能进行了分析对比。研究结果表明:添加纳米Cu颗粒使焊点润湿性能下降。回流焊和时效后,随着纳米Cu颗粒含量的增加,界面金属间化合物(IMC)的厚度均下降,表明纳米Cu颗粒抑制了界面IMC的增厚。对焊点进行了显微硬度测试,当纳米Cu含量为0.1mass%时,硬度相比较于未添加纳米Cu提高27.4%,达到最大值。借助SEM观察焊点剪切断口形貌,发现随着纳米Cu的添加,剪切断裂方式逐渐由韧性断裂向脆性断裂过渡。With the aid of joint strength tester PTR - 1100, hardness tester （ DUH - 211 S） and SEM, this work made a comparative analysis on the microstructure and mechanical properties of Sn -5Sb -xnanoCu/ Cu solder joints. The results show that the addition of nano Cu particles reduce the wettability of Sn - 5Sb - xnanoCu/Cu solder joints. After reflow and aging, the thickness of the IMC interface decreases with the increase of nano Cu particle content, which shows that the nano Cu particles inhibit the thickening of the IMC interface. The microhardness tests of Sn- 5Sb -xnanoCu/Cu solder joints show that, when the content of nano Cu is 0. 1mass% , the hardness reaches the maximum, which is 27.4% higher than that without adding nano Cu. It was found that with the addition of nano Cu, the shear fracture mode gradually changed from ductile to brittle.

关 键 词：复合钎料 金属间化合物 力学性能 纳米Cu颗粒 剪切断口 

分 类 号：TG425[金属学及工艺—焊接]