Sn2.5Ag0.7Cu_xRE钎焊接头组织和高温蠕变行为的研究  

Microstructure and High Temperature Creep Behavior of Sn2.5Ag0.7Cu_x RE Solder Joint

作　　者：许岚[1] 

机构地区：[1]苏州工业职业技术学院精密制造工程系,江苏苏州215000

出　　处：《铸造技术》2017年第10期2495-2499,共5页Foundry Technology

基　　金：江苏省自然科学基金青年项目(BK20160353);江苏高校品牌专业建设工程资助项目(PPZY2015B186)

摘　　要：通过金相显微镜、扫描电镜、透射电镜以及抗蠕变试验机等,研究Sn2.5Ag0.7Cu_xRE钎料合金以及钎焊接头的组织和高温蠕变行为。结果表明,Sn2.5Ag0.7Cu合金组织由富Sn基体相及共晶相构成。共晶相包含二元共晶相β-(Sn)+Cu_6Sn_5、Ag_3Sn+β-(Sn)和三元共晶相β-(Sn)+Ag_3Sn+Cu_6Sn_5。随着稀土含量的增加,合金组织细化作用显著,界面IMC的厚度降低,IMC由尺寸较大的扇贝状转变为波浪状。同时,合金蠕变断裂寿命不断增高,最高可以超过100 h,合金的晶界越来越明显,没有再结晶现象。Microstructure and creep behavior of Sn2.5Ag0.7CuxRE solder alloy and soldering join were researched by means of OM, XRD, TEM, SEM and tensile experiment. The results show that microstructure of the alloy are β-（Sn） ＋Cu6Sn5, Ag3Sn＋β- （Sn）, and β- （Sn）＋Ag3Sn＋CuxSns. It can be concluded that with the increase of rare earth content, the microstructures of the intermetallic compounds decreased, and the thickness of the interfacial IMCs decreased. The IMCs chang from scallop to wavy. With the increase of rare earth content, the creep rupture life of the alloy is increasing, and the grain boundary of the alloy is more obviously. There is no recrystallization behavior and grain refinement.

关 键 词：钎料 显微组织 钎焊 蠕变断裂寿命 

分 类 号：TG407[金属学及工艺—焊接]