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作 者:王洪涛
出 处:《铸造技术》2017年第10期2536-2540,共5页Foundry Technology
摘 要:对铸造生产过程中芯撑的传热,强度设计,压力及尖端对熔点的影响,和焊接近似条件通过仿真、理论分析和计算进行了深入研究。结果表明,发现芯撑在发挥作用时温度很高,在强度设计时必须参考芯撑材料的高温强度,芯撑熔合片的设计有一定作用,但芯撑与基体的结合更多的受控于界面上原子扩散带来的焊合效果,提出了影响结合效果的最重要的印象因素——表面质量,并提出了芯撑工程设计的原则。The chaplet usage skill was investigated from the aspects of heat transfer, strength design, the pressure and shape effect for melting point, and quasi-welding using simulation, theoretical deduction and calculation. The results show that the supporting function is activated at an extra high temperature, so chaplet strength should be the strength at high temperature during strength calculation. The melting flash is of avail to bonding of chaplet and matrix during the melting or welding process controlled by atom diffusion, which is totally affect by the surface cleanliness, and the few suggestions on chaplet design and application are provided.
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